Warning: mysqli::mysqli(): (HY000/1044): Access denied for user 'admin_global'@'localhost' to database 'admin_energetica21_test' in /home/admin/domains/energetica-international.com/public_html/xpanel/require/mysql/config.php on line 46
New wire bond encapsulant and flexible circuit bonding adhesive now available | Europe
 
   

New wire bond encapsulant and flexible circuit bonding adhesive now available

Engineered Material Systems debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications. This new encapsulant/adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. This material has excellent chemical resistance to inks.

The 357-348 adhesive/encapsulant has very high fracture toughness and high adhesion to flexible circuits, FR4 and metal substrates. 357-348 meets circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments.

357-348 is the latest addition to Engineered Material Systems? extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
Share this!
Posted by Gloria Llopis | 2012-04-02