New wire bond encapsulant and flexible circuit bonding adhesive now available

Engineered Material Systems debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications. This new encapsulant/adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. This material has excellent chemical resistance to inks.

The 357-348 adhesive/encapsulant has very high fracture toughness and high adhesion to flexible circuits, FR4 and metal substrates. 357-348 meets circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments.

357-348 is the latest addition to Engineered Material Systems? extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
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Posted by Gloria Llopis | 2012-04-02