Fast cure conductive adhesive for back contact solar modules

The new line of conductive adhesives is designed to make contact from vias or other conductors in the solar cells to the back contact sheet. These adhesives are stress absorbing to withstand the rigors of thermal cycling, and have excellent conductive stability to back contact metallizations during damp heat exposure. The conductive adhesives are designed to cure through the encapsulant lamination and cure process. Fast cure versions are available for co-curing with fast laminating encapsulants.

The DB-1580 Series Conductive Adhesives are the latest addition to Engineered Conductive Materials? full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.
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Posted by Gloria Llopis | 2011-09-08