Engineered Conductive Materials at PVSEC 2011

Engineered Conductive Materials will introduce its new line of conductive adhesives for back contact solar module applications in Hall A1, Stand B4 at the European Photovoltaic Solar Energy Conference and Exhibition (PVSEC), taking place September 5-8, 2011 at the CCH Congress Centre and International Fair in Hamburg, Germany.

The new line of conductive adhesives is designed to make contact from vias in the solar cells to the back contact sheet. These adhesives are stress absorbing to withstand the rigors of thermal cycling, and have excellent conductivity stability to back contact metallizations during damp heat exposure. The conductive adhesives are designed to cure through the encapsulant lamination and cure process.

Company representatives will be available at the show to discuss Engineered Conductive Materials? full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.

Visit Hall A1, Stand B4 at PVSEC to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company.
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Posted by Gloria Llopis | 2011-09-06