DB-1588 low cost conductive adhesive for back contact solar modules
Engineered Conductive Materials introduces its DB-1588 low-cost conductive adhesive for back contact applications in crystalline silicon solar modules.
The new line of conductive adhesives is designed to make contact from vias or other conductors in the solar cells to the back contact sheet. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to back contact metallizations during damp heat exposure. The DB-1588 conductive adhesive is designed to cure through the encapsulant lamination and cure process. This material has a 40 percent lower cost than ECM?s standard silver filled product.
The DB-1588 conductive adhesive is the latest addition to Engineered Conductive Materials? full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications as well as conductive grid inks for photovoltaic applications.
Posted by Gloria Llopis | 2011-11-07